Intel Xeon Gold 6142 gegen AMD Ryzen Embedded R2314. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Desktop / Server Desktop / Server
• Serie
  Intel Xeon Gold AMD Ryzen Embedded
• Generation
  1 2
• CPU Gruppe
  Intel Xeon Gold 5100/6100 AMD Ryzen Embedded R2000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  2.60 GHz 2.10 GHz
• Übertaktung
  Nein Nein
• Zentrale Architektur
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  keine iGPU AMD Radeon Vega 6 Graphics
• GPU frequency
  1.20 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  6
• Shader
  384
• Max. GPU Memory
  -- 2 GB
• Max. displays
  3
• Generation
  8
• technisches verfahren
  14 nm
• Datum der Veröffentlichung
  Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Decode / Encode
• h265 / HEVC (10 bit)
  Nein Decode / Encode
• h264
  Nein Decode / Encode
• VP9
  Nein Decode / Encode
• VP8
  Nein Decode / Encode
• AV1
  Nein Nein
• AVC
  Nein Decode / Encode
• VC-1
  Nein Decode
• JPEG
  Nein Decode / Encode

Overview of the types and quantities of RAM supported by AMD Ryzen Embedded R2314 und Intel Xeon Gold 6142. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  DDR4-2666 DDR4-2666
• Max. Speicher
  32 GB
• ECC
  Ja Ja
• Speicherkanäle
  6 2

Analyze the TDP (Thermal Design Power) requirements of Intel Xeon Gold 6142 und AMD Ryzen Embedded R2314 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  150 W 15 W
• TDP up
  -- 35 W
• TDP down
  -- 12 W
• Maximale Temperatur
  -- 105 °C

Information on architecture, interfaces, and additional instructions supported by Intel Xeon Gold 6142 und AMD Ryzen Embedded R2314, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualisierung
  VT-x, VT-x EPT, VT-d AMD-V, SVM
• ISA-Erweiterungen
  SSE4.1, SSE4.2, AVX2, AVX-512 SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• L2-Cache
  -- 2.00 MB
• L3-Cache
  22.00 MB 4.00 MB
• Architektur
  Skylake Zen+
• technisches verfahren
  14 nm 12 nm
• Steckdose
  LGA 3647 FP5
• Datum der Veröffentlichung
  Q3/2017 Q2/2022