AMD Ryzen Embedded R2312 gegen Intel Xeon Gold 6262V. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  AMD Ryzen Embedded Intel Xeon Gold
• CPU Gruppe
  AMD Ryzen Embedded R2000 Intel Xeon Gold 5200/6200
• Segment
  Desktop / Server Desktop / Server
• Generation
  2 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  normal normal
• Übertaktung
  Nein Nein
• Frequenz
  2.70 GHz 1.90 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  AMD Radeon Vega 3 Graphics keine iGPU
• GPU frequency
  1.20 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  3
• Shader
  192
• Max. GPU Memory
  2 GB --
• Max. displays
  3
• Generation
  8
• technisches verfahren
  14 nm
• Datum der Veröffentlichung
  Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Nein
• h265 / HEVC (10 bit)
  Decode / Encode Nein
• h264
  Decode / Encode Nein
• VP8
  Decode / Encode Nein
• VP9
  Decode / Encode Nein
• AV1
  Nein Nein
• AVC
  Decode / Encode Nein
• VC-1
  Decode Nein
• JPEG
  Decode / Encode Nein

Overview of the types and quantities of RAM supported by Intel Xeon Gold 6262V und AMD Ryzen Embedded R2312. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  DDR4-2400 DDR4-2400
• Max. Speicher
  32 GB
• Speicherkanäle
  2 6
• ECC
  Ja Ja

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded R2312 und Intel Xeon Gold 6262V to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W 135 W
• TDP up
  25 W --
• TDP down
  12 W --
• Maximale Temperatur
  105 °C --

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded R2312 und Intel Xeon Gold 6262V, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA-Erweiterungen
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4.1, SSE4.2, AVX2, AVX-512
• L2-Cache
  1.00 MB --
• L3-Cache
  2.00 MB 33.00 MB
• Architektur
  Zen+ Cascade Lake
• technisches verfahren
  12 nm 14 nm
• Virtualisierung
  AMD-V, SVM VT-x, VT-x EPT, VT-d
• Steckdose
  FP5 LGA 3647
• Datum der Veröffentlichung
  Q2/2022 Q2/2019