AMD Ryzen Embedded R2312 vs Intel Xeon Gold 6262V. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  AMD Ryzen Embedded Intel Xeon Gold
• CPU group
  AMD Ryzen Embedded R2000 Intel Xeon Gold 5200/6200
• Segment
  Desktop / Server Desktop / Server
• Generation
  2 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Core architecture
  normal normal
• Overclocking
  No No
• Frequency
  2.70 GHz 1.90 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  AMD Radeon Vega 3 Graphics no iGPU
• GPU frequency
  1.20 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  3
• Shader
  192
• Max. GPU Memory
  2 GB --
• Max. displays
  3
• Generation
  8
• Technology
  14 nm
• Release date
  Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode No
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode No
• VP8
  Decode / Encode No
• VP9
  Decode / Encode No
• AV1
  No No
• AVC
  Decode / Encode No
• VC-1
  Decode No
• JPEG
  Decode / Encode No

Overview of the types and quantities of RAM supported by Intel Xeon Gold 6262V and AMD Ryzen Embedded R2312. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  DDR4-2400 DDR4-2400
• Max. Memory
  32 GB
• Memory channels
  2 6
• ECC
  Yes Yes

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded R2312 and Intel Xeon Gold 6262V to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W 135 W
• TDP up
  25 W --
• TDP down
  12 W --
• Tjunction max.
  105 °C --

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded R2312 and Intel Xeon Gold 6262V, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• ISA extensions
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4.1, SSE4.2, AVX2, AVX-512
• L2-Cache
  1.00 MB --
• L3-Cache
  2.00 MB 33.00 MB
• Architecture
  Zen+ Cascade Lake
• Technology
  12 nm 14 nm
• Virtualization
  AMD-V, SVM VT-x, VT-x EPT, VT-d
• Socket
  FP5 LGA 3647
• Release date
  Q2/2022 Q2/2019