AMD Ryzen Embedded R2312 kontra Intel Atom C3858. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  AMD Ryzen Embedded Intel Atom
• Grupa CPU
  AMD Ryzen Embedded R2000 Intel Atom C3000
• Segment
  Desktop / Server Desktop / Server
• Pokolenie
  2 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  normal normal
• Overclocking
  Nie Nie
• Częstotliwość
  2.70 GHz 2.00 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  AMD Radeon Vega 3 Graphics brak iGPU
• GPU frequency
  1.20 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  3
• Shader
  192
• Max. GPU Memory
  2 GB --
• Max. displays
  3
• Pokolenie
  8
• Proces technologiczny
  14 nm
• Data wydania
  Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Nie
• h265 / HEVC (10 bit)
  Decode / Encode Nie
• h264
  Decode / Encode Nie
• VP8
  Decode / Encode Nie
• VP9
  Decode / Encode Nie
• AV1
  Nie Nie
• AVC
  Decode / Encode Nie
• VC-1
  Decode Nie
• JPEG
  Decode / Encode Nie

Overview of the types and quantities of RAM supported by Intel Atom C3858 oraz AMD Ryzen Embedded R2312. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  DDR4-2400 DDR4-2400
• Max. Pamięć
  32 GB 256 GB
• Kanały pamięci
  2 2
• ECC
  Tak Tak

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded R2312 oraz Intel Atom C3858 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W 25 W
• TDP up
  25 W --
• TDP down
  12 W --
• Temperatura maksymalna
  105 °C 100 °C

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded R2312 oraz Intel Atom C3858, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Rozszerzenia ISA
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4.1, SSE4.2
• L2-Cache
  1.00 MB 12.00 MB
• L3-Cache
  2.00 MB --
• Architektura
  Zen+ Denverton
• Proces technologiczny
  12 nm 14 nm
• Wirtualizacja
  AMD-V, SVM VT-x, VT-x EPT, VT-d
• Gniazdo
  FP5 BGA 1310
• Data wydania
  Q2/2022 Q3/2017