Qualcomm Snapdragon 888 対 MediaTek Helio X27. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  Qualcomm Snapdragon Mediatek Helio
• 世代
  8 2
• CPUグループ
  Qualcomm Snapdragon 888 MediaTek Helio X20

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 660 ARM Mali-T880 MP4
• GPU frequency
  0.84 GHz 0.88 GHz
• GPU (Turbo)
  ターボなし 0.88 GHz
• 実行部隊
  0 4
• シェーダー
  0 64
• Max. displays
  0 2
• 世代
  6 Midgard 4
• ぎじゅつてきなかだい
  5 nm 16 nm
• 発売日
  Q1/2021 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode いいえ
• VP8
  Decode / Encode Decode / Encode
• AV1
  いいえ いいえ
• AVC
  Decode いいえ
• VC-1
  Decode いいえ
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio X27 と Qualcomm Snapdragon 888. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-4266LPDDR5-3200 LPDDR3-800
• マックス メモリ
  4 GB
• ECC
  いいえ いいえ
• メモリーチャンネル
  4 2

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 888 と MediaTek Helio X27 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 888 と MediaTek Helio X27, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  None None
• ISAエクステンション
  --
• L2-Cache
  1.00 MB --
• L3-Cache
  8.00 MB --
• 建築
  Kryo 680 Cortex-A72 / Cortex-A53
• ぎじゅつてきなかだい
  5 nm 20 nm
• ソケット
  N/A N/A
• 発売日
  Q1/2021 Q1/2017
• Part Number
  -- MT6797X